Stress-Strain Analysis (IPC/JEDEC 9704)
Measurement of the stress in PCBs using strain gauges

With the help of strain gauges, we measure the stress in printed circuit boards (PCBs) while inserted, tested in and removed from a test adapter. The analysis results allow us to identify potential overstraining and correct it. After the test adapter optimisation, we issue a quality assurance certificate which a lot of OEMs request from their suppliers.

  • Detailed analysis report about the mechanical impact of test adapters on inserted PCBs

  • Report with recommended actions to optimise the test adapter (if required)

  • Stress-strain analysis for GTS as well as third-party products

  • Proof of the mechanical quality of your products to your customers

  • Procedure in accordance with international standards IPC/JEDEC 9704

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Why strain gauging PCBs?

If PCBs are overstrained during production, storage or transport, they can take unnoticed mechanical damage and fail systematically later in their service life. Critical straining forces can also occur when the PCB passes through a test stand as part of the production line, for example when inserting the PCB in a test adapter. Therefore, we test the mechanical stress in the PCB throughout the test task, using strain gauges. Based on the results, we can further optimise the test adapter and minimise straining forces.

More and more OEMs ask for proof of the mechanical quality of supplier products

Especially for OEMs the systematic failure of assembled PCBs would mean tremendous costs. That is why more and more of them ask their suppliers to check the mechanical quality of their products, to optimise the production accordingly and to provide related proof. With our certification in accordance with the international standards IPC/JEDEC 9704, you are very well equipped for this purpose.

Typical Procedure of a stress-strain analysis

1. Requirements engineering

We discuss the reasons and requirements of the analysis.

2. PCB analysis

To save costs and time we identify the sectors of your PCB that are assumed to have the highest risk of failure. Only those sectors will be analysed with strain gauges.

3. Planning

We choose suitable strain gauges for your individual case and plan the further steps.

4. Mounting of strain gauges

After intensive cleaning, we prepare your PCB for strain gauging (for example removal of components). After that, strain gauges are mounted.

5. Test execution

We execute the stress-strain analysis while the PCB runs through your typical test stand procedure.

6. Results and report

You will receive a detailed report of the strain gauging results. If required, we will make suggestions on how to optimise your test stand (adapter).